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NEWS

1. New XRF spectrometer -compliant with RoHS/WEEE Directives

2. International Space Conference, ICPMSE-9

Testing Capabilities

Thermal Analysis

Thermal analysis is a series of techniques used to measure physical properties of material vs. temperature.  Our 2005 DSC (Differential Scanning Calorimetry) and TGA (Thermogravimetric Analysis) thermal analysis instruments, and existing TMA (Thermomechanical Analysis) continue to serve our clients in the following areas:

  • Research and Development
  • Quality Control and Assurance
  • Process Optimization
  • Failure Analysis and Root Cause Identification

Thermogravimetric Analysis

ASTM E 1131 / ASTM D 3850 / ASTM D 6370 / ISO 11358 / IPC-TM-650 2.3.40

 

Thermogravimetric analysis measures weight changes associated with thermal events. While TGA is most commonly used to determine compositional analysis, it is also valuable for determining thermal stability. The relative loadings of various constituents within a plastic material, including polymers, plasticizers, additives, carbon black, fillers, glass reinforcement, and moisture content can be assessed.  Furthermore, by analyzing multiple TGA curves obtained under different heating rates, it is possible to predict long-term as well as short-term thermal stability.

 

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